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Hvis plasseringen din ikke er oppført, kan du velge ett av følgende:

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Samsung Semiconductor - K4UBE3D4AM-GUCL

KEY Part #: K7359751

[25749stk Lager]

    Delnummer:
    K4UBE3D4AM-GUCL
    Produsent:
    Samsung Semiconductor
    Detaljert beskrivelse:
    32 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 125 °C 200FBGA Mass Production.
    Manufacturer's standard lead time:
    På lager
    Holdbarhet:
    Ett år
    Brikke fra:
    Hong Kong
    RoHS:
    Betalingsmetode:
    Forsendelsesmåte:
    Familiekategorier:
    KEY Components Co., LTD er en distributør av elektroniske komponenter som tilbyr produktkategorier inkludert: HBM Flarebolt, MODULE, LPDDR5, LPDDR4X, DDR4, LPDDR4, LPDDR3 and SLC Nand ...
    Konkurransefordel:
    We specialize in Samsung Semiconductor K4UBE3D4AM-GUCL electronic components. K4UBE3D4AM-GUCL can be shipped within 24 hours after order. If you have any demands for K4UBE3D4AM-GUCL, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4UBE3D4AM-GUCL Produktegenskaper

    Delnummer : K4UBE3D4AM-GUCL
    Produsent : Samsung Semiconductor
    Beskrivelse : 32 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -40 ~ 125 °C 200FBGA Mass Production
    Serie : DDR3
    tetthet : 32 Gb
    Org. : x32
    Hastighet : 4266 Mbps
    Spenning : 1.8 / 1.1 / 0.6 V
    Temp. : -40 ~ 125 °C
    Pakke : 200FBGA
    Product Status : Mass Production

    Siste nytt

    Samsung Now Mass Producing Industry’s Most Advanced 4Gb DDR3, Using 20 Nanometer Process Technology
    Mission Peak Reference Server System for NGSFF SSD
    Autonomous Driving and the Quest for Safety
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    Speed for the next generation of mobile devices
    Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards
    Driving the Artificial Intelligence Evolution with In-Memory Computing
    Automotive Driven by Small Packages Under the Hood
    Samsung wins 46 CES 2020 Innovation Awards for Outstanding Design and Engineering
    Samsung’s Newest ISOCELL Image Sensor Enables Mobile Devices to ‘Slow Down’ Time
    Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
    NF1 SSD, Reach New Heights with Hyper-Scalable Datacenters
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