Produsent :
Chip Quik Inc.
Beskrivelse :
THERMALLY STABLE SOLDER PASTE NO
sammensetning :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Smeltepunkt :
423 ~ 428°F (217 ~ 220°C)
Form :
Jar, 8.8 oz (250g)
Holdbarhetsstart :
Date of Manufacture
Lagring / kjølingstemperatur :
68°F ~ 77°F (20°C ~ 25°C)