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- Delnummer:
- FI-XPB30SL-HF10
- Produsent:
- JAE Electronics
- Detaljert beskrivelse:
- CONN RCPT 30P 0.039 GOLD SMD R/A.
- Manufacturer's standard lead time:
- På lager
- Holdbarhet:
- Ett år
- Brikke fra:
- Hong Kong
- RoHS:
- Betalingsmetode:
-
- Forsendelsesmåte:
- Familiekategorier:
- KEY Components Co., LTD er en distributør av elektroniske komponenter som tilbyr produktkategorier inkludert: Terminaler - Tilbehør, Bakplankontakter - Hard metrisk, standard, Modulære kontakter - Jacks, Strømtilkoblinger av bladtype - Hus, Terminaler - fat, kulekontakter, D-Sub, D-formede kontakter - Bakskall, hetter, Rektangulære kontakter - overskrifter, mottakere, and Bakplankontakter - ARINC ...
- Konkurransefordel:
- We specialize in JAE Electronics FI-XPB30SL-HF10 electronic components. FI-XPB30SL-HF10 can be shipped within 24 hours after order. If you have any demands for FI-XPB30SL-HF10, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
FI-XPB30SL-HF10 Produktegenskaper
Delnummer :
FI-XPB30SL-HF10
Produsent :
JAE Electronics
Beskrivelse :
CONN RCPT 30P 0.039 GOLD SMD R/A
Serie :
FI-XP
Delstatus :
Obsolete
Koblingstype :
Receptacle
Kontakttype :
Non-Gendered
Stil :
Board to Cable/Wire
Antall stillinger :
30
Antall stillinger som er lastet :
All
Pitch - Parring :
0.039" (1.00mm)
Antall rader :
1
Radavstand - parring :
-
Monteringstype :
Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle
Avslutning :
Solder
Festetype :
Friction Lock
Kontaktfinish - parring :
Gold
Kontaktfinish tykkelse - parring :
12.0µin (0.30µm)
Isolasjonsfarge :
Beige
Isolasjonshøyde :
-
Kontaktlengde - Innlegg :
-
Driftstemperatur :
-
Materialbrennbarhetsvurdering :
UL94 V-0
Kontakt Finish - Post :
Tin
Parret stabling høyder :
-
Ingress Protection :
-
Egenskaper :
Grounding Pins, Shielded, Solder Retention
Nåværende vurdering :
-
Spenningsvurdering :
-
Siste nytt
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