Bergquist - SP600-114

KEY Part #: K6153171

SP600-114 Priser (USD) [198981stk Lager]

  • 1 pcs$0.18588
  • 10 pcs$0.16730
  • 50 pcs$0.15013
  • 100 pcs$0.13281
  • 500 pcs$0.11549
  • 1,000 pcs$0.08661
  • 5,000 pcs$0.07507

Delnummer:
SP600-114
Produsent:
Bergquist
Detaljert beskrivelse:
THERM PAD 24MMX21.01MM GREEN.
Manufacturer's standard lead time:
På lager
Holdbarhet:
Ett år
Brikke fra:
Hong Kong
RoHS:
Betalingsmetode:
Forsendelsesmåte:
Familiekategorier:
KEY Components Co., LTD er en distributør av elektroniske komponenter som tilbyr produktkategorier inkludert: Termisk - dyner, ark, AC fans, Termisk - varmerør, dampkamre, Termisk - lim, epoksy, fett, pastaer, Termisk - lim, epoksy, fett, pastaer, Termisk - Termoelektrisk, Peltier-montering, Termisk - termoelektrisk, Peltier-moduler and Termisk - Tilbehør ...
Konkurransefordel:
We specialize in Bergquist SP600-114 electronic components. SP600-114 can be shipped within 24 hours after order. If you have any demands for SP600-114, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP600-114 Produktegenskaper

Delnummer : SP600-114
Produsent : Bergquist
Beskrivelse : THERM PAD 24MMX21.01MM GREEN
Serie : Sil-Pad® 600
Delstatus : Active
bruk : TO-218, TO-220, TO-247
Type : Pad, Sheet
Form : Rectangular
Outline : 24.00mm x 21.01mm
Tykkelse : 0.0090" (0.229mm)
Materiale : Silicone Elastomer
lim : -
Støtte, bærer : -
Farge : Green
Termisk motstand : 0.35°C/W
Termisk ledningsevne : 1.0 W/m-K

Du kan også være interessert i
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft