Beskrivelse :
LEAD FREE NO CLEAN SOLDER PASTE
sammensetning :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Smeltepunkt :
423 ~ 430°F (217 ~ 221°C)
Form :
Syringe, 0.88 oz (25g)
Holdbarhetsstart :
Date of Manufacture
Lagring / kjølingstemperatur :
35°F ~ 50°F (2°C ~ 10°C)