Produsent :
TE Connectivity AMP Connectors
Beskrivelse :
CONN IC DIP SOCKET 18POS GOLD
Type :
DIP, 0.3" (7.62mm) Row Spacing
Antall posisjoner eller pins (rutenett) :
18 (2 x 9)
Pitch - Parring :
0.100" (2.54mm)
Kontaktfinish - parring :
Gold
Kontaktfinish tykkelse - parring :
25.0µin (0.63µm)
Kontaktmateriale - parring :
Beryllium Copper
Monteringstype :
Through Hole
Egenskaper :
Closed Frame
Pitch - Post :
0.100" (2.54mm)
Kontakt Finish - Post :
Gold
Kontakt ferdig tykkelse - post :
25.0µin (0.63µm)
Kontaktmateriell - Innlegg :
Beryllium Copper
Husmateriell :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Driftstemperatur :
-55°C ~ 125°C