Produsent :
Aries Electronics
Beskrivelse :
CONN IC DIP SOCKET ZIF 28POS
Type :
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Antall posisjoner eller pins (rutenett) :
28 (2 x 14)
Pitch - Parring :
0.100" (2.54mm)
Kontaktfinish - parring :
Nickel Boron
Kontaktfinish tykkelse - parring :
50.0µin (1.27µm)
Kontaktmateriale - parring :
Beryllium Copper
Monteringstype :
Through Hole
Egenskaper :
Closed Frame
Pitch - Post :
0.100" (2.54mm)
Kontakt Finish - Post :
Nickel Boron
Kontakt ferdig tykkelse - post :
50.0µin (1.27µm)
Kontaktmateriell - Innlegg :
Beryllium Copper
Husmateriell :
Polyphenylene Sulfide (PPS), Glass Filled