Advanced Thermal Solutions Inc. - ATS-51250D-C1-R0

KEY Part #: K6263767

ATS-51250D-C1-R0 Priser (USD) [8082stk Lager]

  • 1 pcs$4.33208
  • 10 pcs$4.21441
  • 25 pcs$3.98023
  • 50 pcs$3.74604
  • 100 pcs$3.51189
  • 250 pcs$3.27777
  • 500 pcs$3.04364
  • 1,000 pcs$2.98511

Delnummer:
ATS-51250D-C1-R0
Produsent:
Advanced Thermal Solutions Inc.
Detaljert beskrivelse:
HEAT SINK 25MM X 25MM X 9.5MM. Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 25x25x9.5mm, 36.4mm Fin Tip
Manufacturer's standard lead time:
På lager
Holdbarhet:
Ett år
Brikke fra:
Hong Kong
RoHS:
Betalingsmetode:
Forsendelsesmåte:
Familiekategorier:
KEY Components Co., LTD er en distributør av elektroniske komponenter som tilbyr produktkategorier inkludert: Termisk - Tilbehør, Termisk - termoelektrisk, Peltier-moduler, DC fans, Termisk - Kjøleribber, Termisk - væskekjøling, Termisk - dyner, ark, Termisk - varmerør, dampkamre and Vifter - Tilbehør - Viftesnorer ...
Konkurransefordel:
We specialize in Advanced Thermal Solutions Inc. ATS-51250D-C1-R0 electronic components. ATS-51250D-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-51250D-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-51250D-C1-R0 Produktegenskaper

Delnummer : ATS-51250D-C1-R0
Produsent : Advanced Thermal Solutions Inc.
Beskrivelse : HEAT SINK 25MM X 25MM X 9.5MM
Serie : maxiGRIP, maxiFLOW
Delstatus : Active
Type : Top Mount
Pakken avkjølt : BGA
Vedleggsmetode : Clip, Thermal Material
Form : Square, Angled Fins
Lengde : 0.984" (25.00mm)
Bredde : 0.984" (25.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.374" (9.50mm)
Effektdissipasjon @ temperaturstigning : -
Termisk motstand @ tvungen luftstrøm : 8.60°C/W @ 200 LFM
Termisk motstand @ Natural : -
Materiale : Aluminum
Materiell finish : Black Anodized

Du kan også være interessert i
  • 510-6U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 187.452x152.4mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • 122258

    Wakefield-Vette

    HEATSINK 15817 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 15817, 12x7.38x3.1 Inch

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3N-76.2-25.4-0.07-1A

    t-Global Technology

    PH3N NANO 76.2X25.4X0.07MM.